3D Glass Solutions
Highly Engaged Employees
Highly Engaged EmployeesElectronics · New Mexico, United States · 11-50 Employees
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Overview
Headquarters
5601 Balloon Fiesta Pkwy NE Ste B, Albuq...Phone Number
(505) 916-5590Website
www.3dgsinc.comRevenue
$13.6 MillionIndustry
ZI Rank: 1
Signal Type
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ZI Rank
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About 3D Glass Solutions
3DGS specializes in glass semiconductor packaging and three-dimensional heterogeneous integration (3DHI) services for commercial and defense manufacturers, academia, and government agencies. Their products address thermal, electrical, and dimensional challenges in next-generation RF, HPC, and photonic systems, offering solutions for wireless communications, aerospace, defense, and photonics applications. The company provides high-performance fused silica glass solutions and advanced packaging for AI accelerators and medical diagnostic systems. With a focus on ITAR-compliant manufacturing, 3DGS supports a range of industries with innovative glass substrate technologies.Explore more
3D Glass Solutions Org Chart
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3D Glass Solutions is experiencing very low activity levels compared to other companies in the Manufacturing sector.
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3D Glass Solutions is drawing exceptional interest within the Manufacturing industry, suggesting notable developments or strong market momentum, learn more about 3D Glass Solutions.
3D Glass Solutions financials insights
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2020
Debt
$350K
2022
Series B
$24M
2023
Series C
$30M
3D Glass Solutions Tech Stack
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Project
, according to an internal source in accounting, is planning to release a request for proposal (RFP) for initiatives related to segregation of duties within the next six to nine months. The organization is currently evaluating Oracle Fusion Cloud Risk Management and Compliance. 3D Glass Solutions will be decreasing funding and is expected to decrease workforce due to expected initiative efficiency gains.
Cloud, Spending/Investment, Request for Proposal (RFP), Accounting, Financial Planning, Compliance, Employee Relations, Workforce Management, Financial Reporting, Finance, HR Operations, Organizational Development, Risk
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, according to an internal source in accounting, is planning to release a request for proposal (RFP) for initiatives related to accounts receivable within the next six to nine months. The organization is currently evaluating Gaviti. 3D Glass Solutions will be decreasing funding and is expected to decrease workforce due to expected initiative efficiency gains.
Spending/Investment, Request for Proposal (RFP), Accounting, Financial Planning, Billing & Invoice, Financial Reporting, Finance
Project
Spending/Investment, Request for Proposal (RFP), Accounting, Financial Planning, Billing & Invoice, Financial Reporting, Finance
3D Glass Solutions News & Media
3D Glass Solutions Closes $30 Million Series C Funding Round
ALBUQUERQUE, N.M.--(BUSINESS WIRE)--3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional integrated passive solutions for radio frequency (RF), photonic and datacenters today announced the closing of a $30 million Series C financing. The round was led by Walden Catalyst Ventures, with participation from existing investors, including Intel Capital and Lockheed Martin Ventures, as well as new investments from Applied Ventures, LLC, Cambium Capital, and Mesh CooperaNEW Empty (Air-Filled) Substrate Integrated Waveguide (eSIW) PDK Available From 3DGS
DENVER--(BUSINESS WIRE)--INTERNATIONAL MICROWAVE SYMPOSIUM ––3D Glass Solutions (3DGS), an innovative pure-play glass foundry, today announces its eSIW PDK is now available. With built-in design rule checking (DRC), this PDK allows for seamless design flow from schematic layout to full 3D EM analysis and production of 3DGS’s proprietary process for low loss Antenna-in-Packages at high frequencies. Nokia, a lead customer using the eSIW technology, will demo this product in the 3DGS booth (number3D Glass Solutions Raises Additional $4 Million in Series B1 Round Extension
ALBUQUERQUE, N.M.--(BUSINESS WIRE)--3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional passive radio frequency (RF) devices, announced today it has raised an additional $4 million in an extended Series B1 funding round. 3DGS welcomed new investor Menlo Microsystems Inc., as well as follow-on investments from both Corning Incorporated (NYSE: GLW) and Sun Mountain Capital, bringing the total Series B1 raise to $24 million. “The Series B1 round extension highlight3D Glass Solutions Closes $20 Million Series B1 Funding Round to Accelerate Its Revenue Growth Strategy
ALBUQUERQUE, N.M.--(BUSINESS WIRE)--3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional passive radio frequency (RF) devices, today announced it has secured $20 million in Series B1 funding led by Intel Capital. CerraCap Ventures, Lockheed Martin Ventures and Nagase & Co. Ltd. were also in participation. This round of funding adds Intel Capital’s David Flanagan, Lockheed Martin’s Jeff Cunningham and Nagase’s Yoriyuki Yamashiro to 3DGS’ board of directors. “3
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3DGS specializes in glass semiconductor packaging and three-dimensional heterogeneous integration (3DHI) services for commercial and defense manufacturers, academia, and government agencies. Their products address thermal, electrical, and dimensional challenges in next-generation RF, HPC, and photonic systems, offering solutions for wireless commun... Read More
